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iLC212 Uncooled LWIR 256x192 / 12μm Thermal Imaging Module for Thermal Security Camera
iLC212 uncooled IR imaging module, also known as the uncooled thermal module, is radiometric-capable and has available infrared non-contact temperature measurement function. It includes an exceptionally small size 256x192 / 12μm wafer level package (WLP) infrared detector that captures long-wave infrared (LWIR) spectrum that ranges from 8 to 14μm.
Due to its fully optimized SWaP-C, the iLC212 thermal camera module has low resolution, small size, low power consumption and very low price. Thus, in the field of security and monitoring, it is very suitable for the wide angle and close range temperature measurement and monitoring.
- Fully Optimized SWaP-C applications
- Suitable for various infrared products
- A wide range of thermal imaging applications
- Low Power Consumption
Model | iLC212 |
IR Detector Performance | |
Material | Uncooled Vanadium Oxide |
Resolution | 256×192 |
Pixel Size | 12μm |
Spectral Response | 8μm ~14μm |
NETD | ≤65mK@F1.0@25℃@50Hz |
Image Processing | |
Digital Video | RAW/YUV/BT656; Support USB2.0 Video Transmission; Temperature Measurement Support Parameter Line |
Digital Frame Rate | 25Hz/30Hz |
Image Display | Black-hot/white-hot/Pseudo-color |
Image Algorithm | Nonuniformity Correction (NUC) 3D Image Noise Reduction (3DNR) 2D Noise Reduction (DNS) Dynamic Range Compression (DRC) EE Enhancement |
Start-up Time | ≤3s |
Temperature Measurement | |
Operating Temperature Range | -10℃~+50℃ |
Temperature Measurement Range | -20℃~+150℃, Support Temperature Measurement Range Expansion and Customization |
Temperature Measurement Accuracy | ±3℃/±3% (take the larger value) @23℃±5℃; the Temperature Measurement Distance is 1.5m |
Regional Temperature Measurement | Support Any Area Temperature Measurement, Output Area Maximum Value, Minimum Value and Average Value |
SDK | Windows / Linux Version, Achieve Video Stream Analysis and Gray to Temperature Conversion |
Electrical interface | |
External interface | 30pin_HRS Connector Power Input Digital Video RS232-TTL/USB2.0 GPIO etc. |
Communication | RS232-TTL/USB2.0 |
Expansion Component | VPC Board |
PC Software | |
ICC Software | Module Control and Video Display |
Power System | |
Power Supply | DC 3.3V±0.1V |
Power Dissipation | Steady State: 0.70W/3.3V @23±3℃ |
Physical Property | |
Connectors | External Connector Model: DF40C-30DP-0.4V (51), (HRS-Male) Mating Connector Model: DF40C (2.0)-30DS-0.4V (51), (HRS-Female) |
Size | 21mm×21mm×12.8mm (including 3.2mm lens) |
Weight | 8.9g±0.5g (including 3.2mm lens) |
Environmental Adaptability | |
Operation Temperature | -40℃~+70℃ |
Storage Temperature | -45℃~+85℃ |
Humidity | 5%~95%, non-condensing |
Impact & Vibration Resistance | Impact: half sine wave, 40g/11ms, 3-axis, 6-direction Vibration: 5.35grms, 3 axis |
Certification | ROHS2.0/REACH |
Lens | |
Optional Lens | 3.2mm/F1.1, HFOV: 55.6±2.8°; Coating: AR |
The iLC212 thermal imaging module is applied to the field of security and monitoring, It is suitable to be integrated into the Hidden Camera, Digital Camera, Dome Camera, Box Camera etc.
1. What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.
2. What is WLP?
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.
3. What's the advantage of WLP?
WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. Global Sensor Technology, with volume fabrication capability, is now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.